Insights / Manufacturing
What each of the three qualification stages actually verifies, why skipping straight to PQ backfires, and a worked example of qualifying a reflow oven for a new product.
Process qualification is the structured proof that a manufacturing process will consistently produce a conforming product before it's released for routine production. Rather than one broad check, it's conventionally broken into three stages that each answer a genuinely different question, and skipping or compressing any of them tends to be exactly where "it worked in qualification but not in production" problems come from.
This structure is standard across FDA process validation guidance and most quality frameworks that govern regulated manufacturing, including ISO 13485. It applies to more than final assembly, reflow processes, potting or encapsulation steps, conformal coating, and any process where output quality depends on equipment and parameters staying within a proven range.
| Stage | Question it answers | What it involves |
|---|---|---|
| IQ Installation Qualification | Is the equipment installed correctly, as specified? | Verify equipment matches purchase and design specs, is calibrated, and is installed per the manufacturer's requirements, documented as a formal as-built record. |
| OQ Operational Qualification | Does the process perform as intended across its full operating range, not just at one ideal setting? | Challenge the process at the edges of its intended operating window, not just the nominal setpoint, and confirm it still produces conforming output. |
| PQ Performance Qualification | Does the process hold up under real, sustained production conditions? | Run production-representative lots, typically across multiple operators and shifts, and confirm the process remains in statistical control, not just correct on a single monitored run. |
| IQ | Confirm the oven's zone count, conveyor speed range, and thermocouple calibration certificates are current, and that the installation matches the equipment's utility and clearance requirements. |
| OQ | Run the target reflow profile at the nominal setpoint, then again at the edges of the process window: fastest and slowest allowable conveyor speed, highest and lowest allowable zone temperatures, confirming peak temperature and time-above-liquidus stay within the paste manufacturer's specification at every combination tested. |
| PQ | Run three separate production lots, on different shifts, using incoming solder paste from two different lot numbers, and confirm solder joint quality (visual, X-ray sampling, and any in-line AOI results) remains within acceptance criteria across all three, not just the best-performing one. |
| Common shortcut to avoid | Running only a single well-monitored "golden" lot and calling it PQ. A single lot, however clean, doesn't demonstrate the process holds up across the real variation production will actually see. |
For regulated manufacturing, yes, each stage typically has its own protocol, execution record, and acceptance criteria, even if they happen back-to-back in the same qualification campaign.
Capability analysis is often a core part of PQ's acceptance criteria: demonstrating the process isn't just producing conforming output on average, but is statistically capable of doing so consistently. See our note on Cp and Cpk for how that's calculated.
Generally yes, a new equipment setting, a new material lot source, a relocated line, or a significant volume change should trigger at least a partial requalification, scoped to what actually changed.
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